Molecular dynamics simulation of the thermal transport on holey copper substrates
The mechanism behind heat transfer at the nanoscale is different from that at macroscale as the size of the surface structure reaches the phonon mean free path. In this work, we investigate the effect of the presence of a nano hole on the solidliquid heat transfer. To this end, we perform molecular dynamics simulations of a water film in contact with a copper substrate with nanoscale surface structures–here represented by nanoholes. Our results indicate that the presence of a nanohole with diameter of 20 Å increases significantly the transfer of thermal energy from the copper substrate to the water film.
Date of Appearance
PURE publications; PURE publications submitted in the year 2019; PURE publications submitted in the year 2019 (with associated files); PURE publications (with associated files); PURE publications published in the year 2019; PURE publications published in the year 2019 (with associated files)
Situ , W , Zambrano , H A & Walther , J H 2019 , ' Molecular dynamics simulation of the thermal transport on holey copper substrates ' 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019) , Wicklow , Ireland , 22/07/2019 - 24/07/2019 , .