Selected Article

Title

聚矽氧烷改質環氧樹脂模鑄材的混練與性質

Polysiloxane Modified Epoxy

Creator

周惠隆H. L. Chou

Description

[[abstract]]封膠(encapsulation)成型是IC元件封裝時非常重要的步驟,封膠硬化過程的化學收縮與冷卻時的物理收縮所產生的內應力影響IC封裝良率甚鉅。所以本研究是藉由添加一低應力熱固性二甲基乙烯基聚矽氧烷以同時互穿網方式(simultaneous interpenetrating polymer network , SIN)與環氧樹脂形成半互穿網(semi-IPN)結構。環氧樹脂系統是藉由改變其加速劑TPP的添加量來控制反應速率,矽氧烷系統則藉由架橋劑DCP來控制反應速率;從反應熱與玻璃轉移溫度(glass transition temperature , Tg)間的關係,來了解TPP與DCP在兩者系統中的影響。而以DSC探討反應動力並分別藉由Arrhenius方程式與Kamal’s公式成功的模擬了矽氧烷與環氧樹脂系統,藉由反應動力參數獲得了兩系統交連速率相近的組成。針對環氧樹脂的拉伸機械性質測試,矽氧烷改質環氧樹脂後的楊氏係數和抗拉強度均有下降的趨勢,矽粉的加入會稍微提高其楊氏係數和抗拉強度,但矽氧烷的改質一樣可降低楊氏係數和抗拉強度,而破斷應變略為增加。由DMA測試動態機械性質了解到環氧樹脂改質前後儲存模數對溫度的關係,改質後的儲存模數也有降低的趨勢。吾人以TMA針對各種Tg的環氧樹脂就其在Tg以上或以下的熱膨脹係數(coefficient of thermal expansion)間的關係來探討,從中吾人了解到化學收縮在封膠過程中的重要性,並對矽粉添加的影響加以探討。另外,針對環氧樹脂測試吸濕量,了解改質前後與Tg對吸濕量的關係。經由黏度的測量可預測較佳的模鑄溫度與時間。而在耐燃性方面,改質後僅可延遲環氧樹脂的裂解溫度,而不會增加其殘餘重量比。面對封裝材料日益嚴格的要求,吾人利用矽氧烷改質環氧樹脂以期獲得更好的性質。

[[abstract]]Encapsulation is one of the important steps in IC packaging processes. The yield is highly affected by the residual stress in the packages, which results from the chemical shrinkage due to crosslinking and physical shrinkage during cooling. In this work, a low stress matrix resin is synthesized by adding dimethylvinyl polysiloxane into the o-cresol-formaldehyde novolac epoxy resin (CNE) to form a simultaneous interpenetrating network (SIN). The rate of reaction of CNE is controlled by varying the amount of triphenyl phosphine (TPP), and that of polysiloxane controlled by using the cross-linking agent of dicumyl peroxide. The effects of TPP and DCP in each system can be obtained from the relation between heat of reaction and glass transition temperature, Tg. Differential scanning calorimetry is employed to investigate the reaction kinetics, which reveal that the Arrhenius and Kamal’s reaction schemes successfully model the polysiloxane and epoxy systems, respectively. The prepolymers are prepared according to the kinetic calculations. The method of synthesis can be either through direct blending or through a grafting reaction. The mechanical properties of CNE, SIN, and both CNE and SIN with silica filler are tested. As compared with CNE, the SIN has lower Young’s modulus and tensile strength, and the CNE with silica filler has slightly higher values of both properties. It has observed that, for the CNE with silica filler after having been formed as SIN, its modulus and tensile strength are lowered, and its strain at break increased. Tests of dynamic mechanical properties have been conducted to establish the relationship between storage modulus and temperature, and found that the storage modulus of CNE is lowered after forming into SIN. A thermal gravimetric analyzer is utilized to study properties of coefficient of thermal expansion above or below Tg of various epoxy resins with and without silica filler, which enables us to gain insight into the behaviors of cross-liking shrinkage during encapsulation. Tests of moisture absorption are conducted to study the effects of Tg and SIN on the moisture absorptivity. Measurements of viscosity are made to assist in predicting optimal encapsulation temperature and filling time. As for resistance of flammability, the SIN made exhibits higher pyrolysis temperature without gain of its residual weight. Facing ever-stringent requirements of IC encapsulation it has been found that the polysiloxane-CNE SIN is a promising encapsulant.

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chi[[iso]]en_US

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Subject

封裝樹脂

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碩博士論文

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